EQUIPMENT
Equipment

Supermicro

As a global leader in high performance, high-efficiency server technology, and innovation, we develop and provide end-to-end green computing solutions to the data center, cloud computing, enterprise IT, big data, HPC, and embedded markets. Our Building Block Solutions® approach allows us to provide a broad range of SKUs, and enables us to build and deliver application-optimized solutions based upon your requirements.
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X14H14 Hyper with PCIe 5.0

2U Dual Processor Rackmount

  • CPU:Intel Xeon 6700 series processors with E-cores or AMD EPYC™ 9005/9004 series processors

  • Memory:Up to 32 DIMMs, 9TB DDR5

  • Drives:Up to 24 hot-swap 2.5″ NVMe/SAS/SATA

  • PCIe:Up to 8 PCIe 5.0 slots + 2 PCIe 5.0 AIOM slots

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Universal GPU Systems

  • GPU:NVIDIA HGX H100/H200/B200 4-GPU/8-GPU, AMD Instinct MI325X/MI300X/MI250 OAM Accelerator, Intel Data Center GPU Max Series

  • CPU:Intel® Xeon® or AMD EPYC™

  • Memory:Up to 32 DIMMs, 9TB

  • Drives:Up to 24 Hot-swap E1.S, U.2 or 2.5" NVMe/SATA drives

8U super blade1

8U SuperBlade

  • Available in 8U, 6U and 4U enclosures with hot-swap NVMe support
  • Advanced networking including NDR/HDR/EDR, InfiniBand and 25 Gigabit Ethernet
  • Available in air and direct liquid cooling
X14 All-Flash NVMe1

X14 All-Flash NVMe

 

  • Storage:Up to 32 hot-swap E3.S drives or 16 hot-swap E3.S drives + 8 fixed E3.S 2T CXL Type 3 bays
  • CPU:Dual Intel® Xeon® 6700 series processors with E-cores
  • Memory:Up to 32 DIMMs, 8TB DDR5
  • Expansion:Up to 3 PCIe 5.0 slots + 2 PCIe 5.0 AIOM slots

 

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X14/H14 2U4N FlexTwin™ with Liquid Cooling

  • CPU:Dual Intel Xeon 6900 series processors with P-cores or AMD EPYC™ 9005/9004 series processors per node
  • Memory:Up to 24 DIMMs per node, 9TB DDR5 or 3TB MRDIMM
  • Drives:Up to 2 front hot-swap E1.S PCIe 5.0 NVMe drive bays per node
  • PCIe:1 PCIe 5.0 x16 (LP) + 1 PCIe 5.0 x16 (FHHL) + 1 PCIe 5.0 x16 AIOM per node

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